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  mc145011 rev. 5.0, 11/2006 freescale semiconductor technical data freescale semiconductor, inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. ? freescale semiconductor, in c., 2006. all rights reserved. photoelectric smoke detector ic with i/o for line-powered applications the cmos mc145011 is an advanced sm oke detector component containing sophisticated very-low-power analog and digital circuitry. the ic is used with an in- frared photoelectric chamber. detection is accomplished by sensing scattered light from minute smoke particles or other aeros ols. when detection occurs, a pulsating alarm is sounded via on-chip push-pull driv ers and an external piezoelectric trans- ducer. the variable-gain photo amplifier allows direct interface to ir detectors (photo- diodes). two external capacitors c1 and c2, c1 being the larger, determine the gain settings. low gain is selected by the ic during most of the standby state. me- dium gain is selected during a local-smoke condition. high gain is used during push button test. during standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain, also. the i/o pin, in combination with vss, can be used to interconnect up to 40 units for common signaling. an on-chip current sink provides noise immunity when the i/ o is an input. a local-smoke condition acti vates the short-circuit-protected i/o driv- er, thereby signaling remote smoke to the interconnected units. additionally, the i/ o pin can be used to activate escape lights, enable auxiliary or remote alarms, and/ or initiate auto-dialers. while in standby, the low-supply detection circuitry conducts periodic checks us- ing a load current from the led pin. the trip point is set using two external resistors. the supply for the mc145011 must be a dc power source capable of supplying 35 ma continuously and 45 ma peak. when the mc145011 is in standby, an external led is continuously illuminated to indica te that the device is receiving power. an extinguished led accompanied by a pulsating audible alarm indicates a lo- cal-smoke condition. a pulsating audible alarm with the led illuminated indicates a remote-smoke condition. a beep or chirp indicates a low-supply condition or de- graded chamber sensitivity. a low-supply condition does not affect the smoke de- tection capability if v dd 6 v. therefore, the low-supply condition and degraded chamber sensitivity can be distinguished by performing a push button (chamber) test. this circuit is design ed to operate in smoke detec tor systems that comply with ul217 and ul268 specifications. features ? operating voltage range: 6 to 12 v ? operating temperature range: -10 to 60 c ? average standby supply current (visible led illuminated): 20 ma ? power-on reset places ic in standby mode (non-alarm state) ? electrostatic discharge (esd) and lat ch up protection circuitry on all pins ? chip complexity: 2000 fets, 12 npns, 16 resistors, and 10 capacitors ? pb-free packaging designated by suffix code ed ordering information device package mc145011p plastic dip mc145011ed MCZ145011DW soic package mc145011 p suffix ed suffix (pb-free) plastic dip case 648-08 dw suffix plastic soic case 751g-04 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 c1 c2 detect strobe vdd ired i/o brass test low-supply trip vss r1 osc led feedback silver figure 1. pin connections photoelectric smoke detector ic with i/o for line-powered applications
sensors 2 freescale semiconductor mc145011 figure 2. block diagram table 1. maximum ratings (1) (voltages referenced to v ss ) 1. maximum ratings are those values beyond which damage to the dev ice may occur. functional oper ation should be restricted to th e limits in the electrical characteristics tables. parameter symbol value unit dc supply voltage v dd - 0.5 to +12 v dc input voltage c1, c2, detect osc, low-supply trip i/o feedback test v in - 0.25 to v dd +0.25 - 0.25 to v dd +0.25 - 0.25 to v dd +10 - 15 to +25 - 1.0 to v dd +0.25 v dc input current, per pin i in 10 ma dc output current, per pin i out 25 ma dc supply current, v dd and v ss pins i dd +25 / -150 ma power dissipation in still air 5 seconds continuous p d 1200 (2) 350 (3) 2. derating: -12 mw/ c from 25 to 60 c. 3. derating: - 3.5 mw/ c from 25 to 60 c. this device contains protecti on circuitry to guard against damage due to high static voltages or electric fields. however, prec autions must be taken to avoid applications of any voltage higher than maxi mum rated voltages to this high-impedance circuit. for proper ope ration, v in and v out should be constrained to the range v ss (v in or v out ) v dd except for the i/o, which can exceed v dd , and the test input, which can go below v ss . unused inputs must always be tied to an appropriate logic voltage level (e.g., either v ss or v dd ). unused outputs and/or an unused i/o must be left open. mw storage temperature t stg - 55 to +125 c lead temperature, 1 mm from case for 10 seconds t l 260 c + - + - detect osc r1 test strobe low-supply trip 3 12 13 16 4 15 2 1 c1 c2 amp comp comp alarm logic horn modulator and driver v dd - 5 v ref timing logic v dd - 3.5 v ref zero gain low supply smoke gate on/off on/off 8 9 10 6 11 7 pin 5 = vdd pin 14 = vss ired feedback silver brass i/o gate osc led
sensors freescale semiconductor 3 mc145011 table 2. electrical characteristics (t a = -10 to 60 c unless otherwise indicated, voltages referenced to v ss ) characteristic symbol test condition v dd / v dc min max unit power supply voltage range v dd ? 6.0 12 v supply threshold voltage, low-supply alarm v th low-supply trip: v in = v dd /3 ? 6.5 7.8 v average operating supply current, excluding the visible led current (per package) i dd standby configured per figure 8 12.0 ? 12 a peak supply current, excluding the visible led current (per package) i dd during strobe on, ired off configured per figure 8 12.0 ? 2.0 ma during strobe on, ired on configured per figure 8 12.0 ? 3.0 low-level input voltage i/o feedback test v il 9.0 9.0 9.0 ? ? ? 1.5 2.7 7.0 v high-level input voltage i/o feedback test v ih 9.0 9.0 9.0 3.2 6.3 8.5 ? ? ? v input current osc, detect low-supply trip feedback i in v in = v ss or v dd v in = v ss or v dd v in = v ss or v dd 12.0 12.0 12.0 ? ? ? 100 100 00 na low-level input current test i il v in = v ss 12.0 ? -1 a pull-down current test i/o i ih v in = v dd no local smoke, v in = v dd no local smoke, v in = 17 v 9.0 9.0 12.0 0.5 25 ? 10 100 140 a low-level output voltage led silver, brass v ol i out = 10 ma i out = 16 ma 6.5 6.5 ? ? 0.6 1.0 v high-level output voltage silver, brass v oh i out = -16 ma 6.5 5.5 ? v output voltage strobe (for line regulation, see pin descriptions) v out inactive, i out = -1 a active, i out = 100 a to 500 a (load regulation) ? 9.0 v dd - 0.1 v dd - 4.4 ? v dd - 5.6 v ired inactive, i out = 1 a active, i out = 6 ma (load regulation) ? 9.0 ? 2.25 (1) 1. t a = 25c only. 0.1 3.75 (1) high-level output current i/o i oh local smoke, v out = 4.5 v 6.5 -4 ? ma local smoke, v out = v ss (short circuit current) 12.0 ? -16 off-state output leakage current led i oz v out = v ss or v dd 12.0 ? 1 a common mode c1, c2, detect voltage range v ic local smoke, push button test, or chamber sensitivity test ? v dd - 4 v dd - 2 v smoke comparator internal reference voltage v ref local smoke, push button test, or chamber sensitivity test ? v dd - 3.08 v dd - 3.92 v
sensors 4 freescale semiconductor mc145011 table 3. ac electrical characteristics (reference timing diagram figure 6 and figure 7 ) (t a = 25 c, v dd = 9.0 v, component values from figure 8 : r1 = 100.0 k ? , c3 = 1500.0 pf, r2 = 10.0 m ? ) no. characteristic symbol test condition min max unit 1 oscillator period (1) 1. oscillator period t (= t r + t f ) is determined by the external components r1, r2, and c3 where t r = (0.6931) r2 c3 and t f = (0.6931) r1 c3. the other timing charac teristics are some multiple of the os cillator timing as shown in the table. 1/f osc free-running sawtooth measured at pin 12 9.5 11.5 ms 2 led status t led no local smoke, and no remote smoke illuminated 3 remote smoke, but no local smoke illuminated 4 local smoke or push button test extinguished 5 strobe pulse width t w(stb) 9.5 11.5 ms 6 ired pulse period t ired smoke test 9.67 11.83 s 7 chamber sensitivity test, without local smoke 38.9 47.1 8 push button test 0.302 0.370 9 ired pulse width t w(ired) 94 116 s 10 ired rise time t r ? 30 s ired fall time t f ? 200 11 silver and brass modulation period t mod local or remote smoke 297 363 ms 11, 12 silver and brass duty cycle t on /t mod local or remote smoke 73 77 % 13 silver and brass chirp pulse period t ch low supply or degraded chamber sensitivity 38.9 47.1 s 14 silver and brass chirp pulse width t w(ch) low supply or degraded chamber sensitivity 9.5 11.5 ms 15 rising edge on i/o to smoke alarm response time t rr remote smoke, no local smoke ? 800 ms 16 strobe pulse period t stb smoke test 9.67 11.83 s 17 chamber sensitivity test, without local smoke 38.9 47.1 18 low supply test, without local smoke 38.9 47.1 19 push button test 0.302 0.370 table 4. pin description pin no. pin name description 1 c1 a capacitor connected to this pin as shown in figure 8. determines the gain of the on-chip photo amplifier during push button test and chamber sensitivity test (high gain). the capacit or value is chosen such that the alarm is tripped from background reflections in the chamber during push button test. a v 1 + (c1/10) where c1 is in pf. caution: the value of the closed-loop gain should not exceed 10,000. 2 c2 a capacitor connected to this pin as shown in figure 8. determines the gain of the on-chip photo amplifier except during push button or chamber sensitivity tests. a v 1 + (c2/10) where c2 is in pf. this gain increases about 10% during the ired pulse, after two consecutive local smoke detections. resistor r14 must be installed in series with c2. r14 [1/(12 c2) ] - 680 where r14 is in ohms and c2 is in farads. 3 detect this input to the high-gain pulse amplifier is tied to t he cathode of an external photodiode. the photodiode should have low capacitance and low dark leakage current. the diode must be shunted by a load resistor and is operated at zero bias. the detect input must be ac/dc decoupled from all other si gnals, vdd, and vss. lead length and/or foil traces to this pin must be minimized, also. see figure 9.
sensors freescale semiconductor 5 mc145011 4 strobe this output provides a strobed, regulated voltage referenced to v dd . the temperature coeffici ent of this voltage is 0.2% c maximum from - 10 to 60 c. the supply-voltage coeffi cient (line regulation) is 0.2%/v maximum from 6 to 12 v. strobe is tied to external resistor string r8, r9, and r10. 5 vdd this pin is connected to the posit ive supply potential and may range from + 6 to + 12 v with respect to v ss . 6 ired this output provides pulsed base current for external npn transisto r q1 used as the infrared emitter driver. q1 must have 100. at 10 ma, the temperature coefficient of the output voltage is typically + 0.5%/ c from - 10 to 60 c. the supply-voltage coefficient (line regulation) is 0.2%/v maximum from 6 to 12 v. th e ired pulse width (active-high) is determined by external components r1 and c3. with a 100 k ? /1500 pf combination, the nominal width is 105 s. to minimize noise impact, ired is not active when the visible led and horn outputs are active. ired is active near the end of strobe pulses for smoke tests, chamber sensitivity test, and push button test. 7 i/o this pin can be used to connect up to 40 units together in a wired-or c onfiguration for common signaling. v ss is used as the return. an on-chip current si nk minimizes noise pick up during non-sm oke conditions and eliminates the need for an external pull-down resistor to complete the wired-or. re mote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. i/o can also be used to activate escape lights, aux iliary alarms, remote alarms, and/or auto-dialers. as an input, this pin feeds a positive- edge-triggered flip-flop whose output is sampled nominally every 625 ms during standby (using the recommended component values). a local-smok e condition or the push button-test mode forces this current-limited output to source current. all inpu t signals are ignored when i/o is sourcing current. if unused, i/o must be left unconnected. 8 brass this half of the push-pull driver output is connected to the metal support electr ode of a piezoelectr ic audio transducer and to the horn-starting resistor. a continuous modulated t one from the transducer is a smoke alarm indicating either local or remote smoke. a short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 9 silver this half of the push-pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the horn-starting capacitor. 10 feedback this input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the horn-starting resistor and capacitor through current-limiting resistor r4. if unused, this pin must be tied to vss or vdd. 11 led this active-low open-drain output direct ly drives an external visible led. the load for the low-supply test is applied by this output. this low-supply test is non-coincident with the smoke tests, chamber sensitivity test, push bu tton test, or any alarm signals. the led also provides a visual indica tion of the detector status as follows, assuming the component values shown in figure 8 : standby (includes low-supply and chamber sens itivity tests) - constantly illuminated local smoke - constantly extinguished remote smoke - constantly illuminated push button test - constantly extinguished (syste m ok); constantly illu minated (system problem) 12 osc this pin is used in conjunction with exter nal resistor r2 (10 m ? ) to v dd and external capacitor c3 (1500 pf) to v dd to form an oscillator with a nominal period of 10.5 ms. 13 r1 this pin is used in conjuncti on with resistor r1 (100 k ? ) to pin 12 and c3 (1500 pf, see pin 12 description) to determine the ired pulse width. with this rc comb ination, the nominal pulse width is 105 s. 14 vss this pin is the negative supply potential and the retu rn for the i/o pin. pin 14 is usually tied to ground. 15 low- supply trip this pin is connected to an external voltage which determines the low-supply al arm threshold. the trip voltage is obtained through a resistor divider connected between the vdd and led pins. the low-supply alarm threshold voltage (in volts) (5r7/r6) + 5 where r6 and r7 are in the same units. 16 test this input has an on-chip pull-down device an d is used to manually invoke a test mode. the push button test mode is initiated by a high level at pin 16 (usu ally depression of a s.p.s.t. normally-open push button switch to v dd ). after one oscillator cycle, ired pulses approximately every 336 ms, regardless of the presence of smoke. additionally, the amplifier gain is increased by automatic select ion of c1. therefore, the background reflections in the smoke chamber may be interpreted as smoke, generating a simulated-smoke condition. after the second ired pulse, a successful test activates the horn-driver and i/o circuits. the active i/o allows remote signaling for system testing. when the push button test switch is released, the test input returns to v ss due to the on-chip pull- down device. after one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated-smoke condition. after two additional ired pulses, less than a second, the ic exits the alarm mode and returns to standby timing. table 4. pin description (continued) pin no. pin name description
sensors 6 freescale semiconductor mc145011 figure 3. ac characteristics versus supply figure 4. ac characteristics versus temperature figure 5. rc component variation over temperature pulse width of ired period or pulse width of other parameters ac parameter (normalized to 9.0 v value) vdd, power supply voltage (v) 1.02 0.98 0.96 1.00 1.04 6.0 7.0 8.0 9.0 10.0 12.0 11.0 t a = 25c note: includes external component variations. see figure 5 . pulse width of ired period or pulse width of other parameters ac parameter (normalized to 25 o c value) t a , ambient temperature ( c) -10 0 10 20 40 50 60 1.02 1.01 0.99 0.98 1.00 30 v dd = 9.0 v 10 m ? carbon composition 100 k ? metal film 1500 pf dipped mica component value (normalized to 25 o c value) t a , ambient temperature ( c) -10 0 10 20 30 40 50 60 1.03 1.02 1.01 1.00 0.99 0.98 note: these components were used to generate figure 4 .
sensors freescale semiconductor 7 mc145011 figure 6. standby timing diagram low supply test (internal) smoke test (internal) chamber test (internal) osc (pin 12) led (pin 11) silver, brass (internal) enable no low supply chirps ired (pin 6) strobe (pin 4) 14 notes: numbers refer to the ac electrical characteristics table. illustration is not to scale. chamber sensitivity ok indicate low supply chirps indicate degraded chamber sensitivity 13 power-on reset (continuously illuminated) 13 18 9 17 6 6 16 2 7 1
sensors 8 freescale semiconductor mc145011 figure 7. smoke timing diagram low supply (internal) ired (pin 6) test (internal) strobe (pin 4) i/o (pin 7) silver, brass (not performed) (not performed) 10 10 9 ired 10% 90% 5 19 led (pin 11) 4 (as input) (as output) (as output) enable 15 12 11 no smoke push button local smoke (remote smoke = don't care) remote smoke (no local smoke) notes: numbers refer to the ac electrical characteristics table. illustration is not to scale. test 3 no smoke 6 8 4 (continuously illuminated) (extinguished) (internal) test chamber
sensors freescale semiconductor 9 mc145011 figure 8. typical application 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 test low-supply trip vss r1 osc led feedback silver vdd ired i/o brass strobe detect c1 c2 horn x1 to other mc145011(s), escape light (s), auxiliary alarm (s), remote alarm (s), and/or auto-dialer ir current r13* 4.7 to 22 q1 2.2 m r5 ? d3 visible led r7 47 k r6 100 k sw1 + + mc145011 push button test r2 10 m 0.01 f c6 ? c3 1500 pf r1 100 k r3 470 r4 ? 100 k 1 to 22 f c4** c1 0.047 f c2* 4700 pf r14 560 ? r11 250 k d1 ir detector r8 8.2 k r9 ? 5 k r10 4.7 k d2 ir emitter r12 1 k c5 100 f ? values for r4, r5, and c6 may differ dep ending on type of piezoelectric horn used. * c2 and r13 are used for coarse sensitivity adjustment. typical values are shown. ? r9 is for fine sensitivity adjustment (optional). if fixed resistors are used, r8 = 12 k, r10 is 5.6 k to 10 k, and r9 is elim inated. when r9 is used, noise pickup is increased due to antenna effects. shielding may be required. ** c4 should be 22 f if b1 is a carbon battery. c4 could be reduced to 1 f when an alkaline battery is used. v+
sensors 10 freescale semiconductor mc145011 calibration to facilitate checking the sensitivity and calibrating smoke detectors, the mc145011 can be placed in a calibration mode. in this mode, certain device pins are controlled/ reconfigure as shown in ta b l e 5 . to place the part in the calibration mode, pin 16 (test) must be pulled below the v ss pin with 100 a continuously drawn out of the pin for at least one cycle on the osc pin. to exit this mode, the test pin is floated for at l east one osc cycle. in the calibration mode, the ired pulse rate is increased to one for every osc cycle. also , strobe is always active low. figure 9. recommended pcb layout table 5. configuration of pins in the calibration mode pin description comment 7 i/o disabled as an output. forcing th is pin high places the photo amp output on pin 1 or 2, as determined by low-supply trip. the amp's output appear s as pulses and is referenced to v dd . 15 low-supply trip if the i/o pin is high, pin 15 controls which gain capacitor is used. low: normal gain, amp output on pin 1. high: supervisory gain, amp output on pin 2. 10 feedback driving this input high enabl es hysteresis (10% gai n increase) in the photo amp; pin 15 must be low. 12 osc driving this input high brings t he internal clock high. driving the inpu t low brings the internal clock low. if desired, the rc network for the oscillator may be left in tact; this allows the oscillator to run similar to the normal mode of operation. 9 silver this pin becomes the smoke comparator output. w hen the osc pin is toggling, positive pulses indicate that smoke has been detected. a static low level indicates no smoke. 8 brass this pin becomes the smoke integrator output. that is, 2 consecutive smok e detections are required for ?on? (static high level) and 2 consecutive no-detections for ?off? (static low level). notes: illustration is bottom view of layout using a dip. top view for soic layout is mirror image. optional potentiometer r9 is not included. drawing is not to scale. leads on d1, r11, r8, and r10 and their associated traces must be kept as short as possible. this practice minimizes noise pick up. pin 3 must be decoupled from all other traces. pin 8 pin 16 pin 9 pin 1 c1 r11 d2 r8 mounted in chamber c2 r10 do not run any additional traces in this region c2 r14
sensors freescale semiconductor 11 mc145011 package dimensions case 648-08 issue r 16-lead plastic dip notes: 1. 2. 3. 4. 5. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension l to center of leads when formed parallel. dimension b does not include mold flash. rounded corners optional. -a- b f c s h g d 16 pl j l m seating plane 1 8 9 16 k -t- m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 010010 s 0.020 0.040 0.51 1.01 style 1: pin 1. cathode 2. cathode 3. cathode 4. cathode 5. cathode 6. cathode 7. cathode 8. cathode 9. anode 10. anode 11. anode 12. anode 13. anode 14. anode 15. anode 16. anode style 2: pin 1. common drain 2. common drain 3. common drain 4. common drain 5. common drain 6. common drain 7. common drain 8. common drain 9. gate 10. source 11. gate 12. source 13. gate 14. source 15. gate 16. source notes: 1. 2. 3. 4. 5. 6. dimensions are in millimeters. dimensioning and tolerancing per asme y14.5m, 1994. datums a and b to be determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include mold flash, protrusion or gate burrs. mold flash, protrustion or gate burrs shall not exceed 0.15mm per side. this dimension is determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25mm per side. this dimension is determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include dambar protrusion. allowable dambar protrusion shall not cause the lead width to exceed 0.62mm. seating plane 0.49 16x b m 0.25 a t 0.35 2.65 2.35 0.25 0.10 6 t 16x 0.1 t 1.27 14x 8 9 1 16 8 x 10.55 10.05 m 0.25 b 4 10.45 10.15 a 7.6 7.4 b pin 1 index pin's number 5 a a 0.75 x45 ? 0.25 7? 1.0 0.4 0? 0.32 0.23 section a-a case 751g-04 issue d 16-lead soic
how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com mc145011 rev. 5.0 11/2006 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2006. all rights reserved. rohs-compliant and/or pb-free versions of freescale products have the functionality and electrical characteristics of thei r non-rohs-compliant and/or non-pb-free counterparts. for further information, see http://www.freescale.com or contact your freescale sales representative. for information on freescale?s environmental products program, go to http:// www.freescale.com/epp .


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